Key Responsibilities
- Design, develop, and optimize co-packaged optics(CPO) and COB packaging processes
(e.g., flip-chip BGA (FCBGA), wafer-level packaging (WLP), SiP, 3D packaging).
- Collaborate with cross-functional teams (product design, materials, QA) to define
packaging requirements and specifications.
- Conduct DOE (Design of Experiments) to validate process parameters and improve
yield.
- Troubleshoot packaging-related issues (e.g., warpage, delamination, thermal
performance) during prototyping and mass production.
- Perform failure analysis (FA) and root-cause analysis (RCA) using tools such as SEM, X
ray, and CSAM.
- Evaluate new packaging materials (substrates, underfills, mold compounds) and
emerging technologies (TSV, hybrid bonding, fan-out).
- Create detailed process workflows, SOPs, and technical reports.
- Ensure compliance with industry standards (IPC, MIL-STD) and customer-specific
requirements.
- Work with suppliers and OEMs to qualify new equipment/tools (e.g., RDL, bumping, die
attach, wire bonding, molding).
- Drive innovation in packaging architecture for miniaturization, thermal management,
and signal integrity.
Qualifications
- Semiconductor, Materials Science, Mechanical Engineering, Electrical Engineering, or related field.
- Deep knowledge of packaging technologies (e.g., flip-chip, thermocompression bonding,
- about 5 years of hands-on experience in semiconductor packaging process
development.
- Proven track record in high-volume manufacturing environments (OSAT/foundry
experience is a plus).
epoxy dispensing).
- Proficiency in simulation tools (ANSYS, COMSOL) and CAD software (AutoCAD,
SolidWorks).
- Familiarity with metrology tools (profilometers, bond testers) and statistical analysis
(Minitab, JMP).
- Strong analytical and problem-solving abilities.
- Excellent communication skills for cross-team and customer collaboration.
- Experience with heterogeneous integration (chiplets, CoWoS) or advanced interconnects
(Cu-Cu hybrid bonding).
- Knowledge of reliability testing (HTOL, TCT, HAST) and DOE methodologies.
- Certification in Six Sigma, Lean Manufacturing, or Project Management (PMP).