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Primary Responsibilities:
1. Hands-on technical ownership of new and established products within the Automotive MOSFET Division.
2. Leads and manages new product introduction of leading-edge products from product definition and development through to characterization, qualification, and release phases, liaising with Market development, R&D, Package, Device design and other manufacturing organizations.
3. Supports product problem solving with manufacturing, CQM, Product marketing and Application organizations within a fast-paced Automotive customer environment.
4. Defines technical management presentations related to technical problems and project status.
5. Liaise with Europe and Asia Pacific wafer fabrication and package assembly operations and engineering teams in yield enhancement and quality improvement programs.
6. Defines and reviews Automotive product datasheets and technical specifications.
7. Define statistical test methods to optimize yield and drive quality defect reduction programs.
8. Organizes and reviews electrical and thermal characterization data and formulates device datasheets for new product releases.
9. Supports cost reduction programs through engineering lot evaluations.
Requirements:
1. BS Degree in electrical engineering, Physics or Microelectronics or similar (Masters preferred)
2. 7 + years Product engineering experience or similar field with good knowledge of Discrete Power MOS semiconductor devices and Trench MOS Technologies
3. Strong multi-tasking project and technical skills are required to drive new product introduction from product definition through to device characterization, qualification and final datasheet release to sales
4. Strong experience in product / process problem solving using statistical data analytics leading-edge yield management software
5. Experience in the support of offshore facility to facility product transfers (package and wafer)
6. Familiarity with Automotive AEC Q101 testing and qualification requirements/ methods is a plus
7. Familiarity with MOSFET semiconductor ATE (automatic test equipment) Wafer and Package test methods are an advantage
8. Must have experience in interfacing with offshore Product Engineers - Europe - Asia- USA and drive international teams in a collaborative and time conscious fashion
9. Familiar with 8D and FMEA processes and concepts
10. Must be willing to travel to offshore sites in USA, Asia and Europe