雇員點評標簽
職位描述
MOSFET半導體技術8DFMEA
The job location is in Newport UK.
Primary Responsibilities： 1. Hands-on technical ownership of new and established advanced commercial/ Industrial products within the Silicon MOSFET Division.
2. Leads and manages new product introduction of leading-edge products from product definition and development through to characterization, qualification, and release phases, liaising with Market development, R&D, Package, Device design and other manufacturing organizations.
3. Supports product problem solving with manufacturing, CQM, Product marketing and Application organizations within a fast-paced Automotive customer environment.
4. Defines technical presentations related to technical product problems.
5. Liaise with Europe and Asia Pacific wafer fabrication and package assembly operations and engineering teams in yield enhancement and quality improvement programs.
6. Define statistical test methods to optimize yield and drive quality defect reduction programs.
7.Organizes and reviews electrical and thermal characterization data and formulates device datasheets for new product releases.
8.Supports cost reduction programs through engineering lot evaluations and qualifications.
2. Leads and manages new product introduction of leading-edge products from product definition and development through to characterization, qualification, and release phases, liaising with Market development, R&D, Package, Device design and other manufacturing organizations.
3. Supports product problem solving with manufacturing, CQM, Product marketing and Application organizations within a fast-paced Automotive customer environment.
4. Defines technical presentations related to technical product problems.
5. Liaise with Europe and Asia Pacific wafer fabrication and package assembly operations and engineering teams in yield enhancement and quality improvement programs.
6. Define statistical test methods to optimize yield and drive quality defect reduction programs.
7.Organizes and reviews electrical and thermal characterization data and formulates device datasheets for new product releases.
8.Supports cost reduction programs through engineering lot evaluations and qualifications.
Requirements:
1. Bachelor’s degree in electrical engineering, Physics or Microelectronics or similar.
2. 8 + years Product engineering experience or similar field with good knowledge of Discrete Power MOS semiconductor devices and Trench MOS Technologies.
3. Strong multi-tasking project and technical skills are required to drive new product introduction from product definition through to device characterization, qualification and final datasheet release to sales.
4. Experience in building new product data sheets with electrical and thermal product data.
5. Strong experience in product / process problem solving using statistical data analytics leading-edge yield management software.
6. Experience in the support of offshore facility to facility product transfers. (package and wafer)
7. Familiarity with MOSFET semiconductor ATE (automatic test equipment) Wafer and Package test methods are an advantage.
8. Must have experience in interfacing with offshore Product Engineers - Europe - Asia- USA and drive international teams in a collaborative and time conscious fashion.
9. Familiar with 8D and FMEA processes and concepts.
10. Must be willing to travel to offshore sites in USA, Asia and Europe.
2. 8 + years Product engineering experience or similar field with good knowledge of Discrete Power MOS semiconductor devices and Trench MOS Technologies.
3. Strong multi-tasking project and technical skills are required to drive new product introduction from product definition through to device characterization, qualification and final datasheet release to sales.
4. Experience in building new product data sheets with electrical and thermal product data.
5. Strong experience in product / process problem solving using statistical data analytics leading-edge yield management software.
6. Experience in the support of offshore facility to facility product transfers. (package and wafer)
7. Familiarity with MOSFET semiconductor ATE (automatic test equipment) Wafer and Package test methods are an advantage.
8. Must have experience in interfacing with offshore Product Engineers - Europe - Asia- USA and drive international teams in a collaborative and time conscious fashion.
9. Familiar with 8D and FMEA processes and concepts.
10. Must be willing to travel to offshore sites in USA, Asia and Europe.
工作地點
天津濱海新區(qū)第六大街
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職位發(fā)布者
陳鳳/人事經(jīng)理
剛剛活躍立即溝通
通用半導體（中國）有限公司ABOUT VISHAY INTERTECHNOLOGY Vishay Intertechnology was founded in 1962. Today, Vishay Intertechnology is manufacturers of discrete semiconductors and passive electronic components. Vishay Intertechnology components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Its innovations in technology, successful acquisition strategy, superior product quality, and“one-stop shop” service to customers have made the Company a global industry leader. More information about Vishay, please refer to http://www.vishay.com.關于威世集團威世成立于1962。威世是分立半導體和被動元件的制造商之一。威世元件用于工業(yè)、計算機、汽車、消費、電信、軍事、航空及醫(yī)療市場的各種類型的電子設備中。威世憑借技術、成功收購戰(zhàn)略、注重降低成本以及提供“一站式”服務已使該公司成為全球業(yè)界的領先者。有關威世的詳細信息，敬請瀏覽網(wǎng)站 http://www.vishay.com。ABOUT VISHAY GENERAL SEMICONDUCTOR CHINA CO., LTDVishay General Semiconductor China Co., Ltd.(VGSC) locates in TEDA, Tianjin. VGSC is an American invested company and was founded on May 1, 1995. It covers an area of 50,000 M2 and employs approximately 2000 employees. The main products are Diodes and Rectifiers, which are used in all types of electronic devices and equipment, in the automotive, telecommunications, computing, and consumer markets.關于通用半導體（中國）有限公司坐落于天津經(jīng)濟技術開發(fā)區(qū)美國獨資企業(yè),威世通用半導體（中國）有限公司（簡稱VGSC）成立于1995年5月1日，公司總投資額超1億美金，占地面積50000平方米，現(xiàn)有員工1800多名。 VGSC的主要產(chǎn)品包括塑封二極管，橋式整流器及表面貼裝功率整流器，產(chǎn)品廣泛應用于汽車、通訊、計算機和消費電子等領域。威世集團承諾招聘過程中不會發(fā)生任何非法歧視。應聘者在應聘過程中不會因種族、種姓、人種、膚色、年齡、性別、出生、社會背景、性取向、性別認同和性別表現(xiàn)、民族、國籍、工會或任何其他合法化組織的會員身份、殘疾、懷孕、宗教信仰、政治派別或觀點、家庭責任、社會成員、服軍役狀況、受保護的遺傳信息、婚姻狀況、疾病等原因而受到歧視、排斥或優(yōu)待。招聘過程中不會以任何形式對應聘者奴役、強迫、抵債、契約、拐賣或非自愿勞動。這包括不得以威脅、暴力、脅迫、誘拐或勞工及服務欺詐等手段進行招聘。
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